Low noise and high performance LSI device, layout and manufacturing method

ABSTRACT

In semiconductor devices in which both NMOS devices and PMOS devices are used to perform in different modes such as analog and digital modes, stress engineering is selectively applied to particular devices depending on their required operational modes. That is, the appropriate mechanical stress, i.e., tensile or compressive, can be applied to and/or removed from devices, i.e., NMOS and/or PMOS devices, based not only on their conductivity type, i.e., n-type or p-type, but also on their intended operational application, for example, analog/digital, low-voltage/high-voltage, high-speed/low-speed, noise-sensitive/noise-insensitive, etc. The result is that performance of individual devices is optimized based on the mode in which they operate. For example, mechanical stress can be applied to devices that operate in high-speed digital settings, while devices that operate in analog or RF signal settings, in which electrical noise such as flicker noise that may be introduced by applied stress may degrade performance, have no stress applied.

RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.11/067,836, filed on Feb. 28, 2005, which relies for priority uponKorean Patent Application number 2004-0021569, filed in the KoreanIntellectual Property Office on Mar. 30, 2004, the contents of which areincorporated herein in their entirety by reference.

FIELD OF THE INVENTION

The invention is directed to semiconductor devices and, moreparticularly, to Large Scale Integration (LSI) semiconductor devices,such as metal-oxide-silicon (MOS) transistors in which mechanical stressengineering is employed to improve device performance.

BACKGROUND OF THE INVENTION

The carrier mobility in a MOS transistor has a significant impact onpower consumption and switching performance of the device. Improvementin carrier mobility allows faster switching speed and allows foroperation at low voltages, resulting in reduced power consumption.

Mechanical stress engineering has been employed in MOS transistors toimprove carrier mobility. Tensile stress on a channel region causesincreased current in an NMOS transistor but causes decreased current ina PMOS transistor. Compressive stress on the channel region causesincreased current in a PMOS transistor but causes decreased current inan NMOS transistor.

FIG. 1 is a schematic cross-sectional view of a MOS device illustratingan approach to introducing mechanical stress to improve carrier mobilityin the device. The device is formed in a substrate 10 and is isolated byisolation regions 12 formed in the substrate 10. The transistor deviceincludes source/drain regions 22, 26 formed in the substrate 10 defininga channel region 18 therebetween. A gate structure includes a gatedielectric 14 formed on the substrate 10, a conductive gate layer 20over the gate dielectric and a silicide layer 30 formed over theconductive gate layer 20. Insulating sidewall spacers 24 are formed onthe sidewalls of the gate structure.

Mechanical stress is introduced into the channel 18 by a stress controllayer 40 formed over the gate structure and the top surface of thesource/drain regions 26 and substrate 10. Specifically, tensile stressis introduced into the MOS transistor structure as indicated by thearrows in the figure. Another approach to introducing tensile stressinto the channel 18, as illustrated by the arrows in FIG. 1, is thesilicide layer 30 formed in the source/drain regions 22, 26. Aftersilicidation, the silicide regions 30 occupy less volume than theoriginal source/drain material replaced by the silicide. As a result,tensile stress is introduced into the channel 18.

In addition to the improvement in carrier mobility, the introduction ofmechanical stress into a MOS transistor has also been shown to degradethe performance of the device by introducing electrical noise,specifically, flicker noise. Flicker noise, also commonly referred to as“1/f noise,” is a type of noise whose power spectrum P(f) as a functionof frequency f behaves in accordance with P(f)=1/f^(n), where a is veryclose to 1. Flicker noise is also commonly referred to as “pink noise”because most of the noise power is concentrated at the lower end of thefrequency spectrum. Flicker noise is considered to be caused not only bythe trapping and detrapping of carriers, but also by mobility modulationvia carrier scattering due to the trapped charges. Flicker noisedegradation can be an important factor for both low frequency analogcircuits and high performance digital circuits. Although the flickernoise is generated at relatively low frequencies, the noise may be verysignificant to some RF circuits since it is up-converted to the highfrequency spectrum and degrades the coherency of oscillation.

FIGS. 2A and 2B are graphs illustrating the relationship between stressengineering in a MOS device and noise. FIG. 2A is a graph of the noisepower Svg distribution between stress-enhanced and stress-attenuatedtransistors. The measurements are taken at Vd=0.05V and Vg=0.85V for anNMOS device, and Vd=−0.05V and Vg=−0.85V for a PMOS device. FIG. 2B is agraph of Noise Power Ratio versus maximum transconductance (Gmmax)improvement ratio of a CMOS device. The graph of FIG. 2B illustratesthat both tensile and compressive stress on a MOS device degradeperformance from the standpoint of flicker noise.

Hence, enhanced stress engineering applied to MOS devices improvesperformance of MOS transistors but degrades flicker noisecharacteristics. That is, in both NMOS and PMOS devices, both tensilestress and compressive stress enhance performance of the devices butdegrade the flicker noise characteristics of both devices. Therefore,stress engineering is not always an acceptable means for improvingoverall circuit performance, when flicker noise characteristics areconsidered, such as, in particular, in analog applications, RFapplications and mixed-signal applications, e.g., system LSIapplications.

SUMMARY OF THE INVENTION

It is a feature of the invention to provide a semiconductor device suchas an LSI device having mixed-signal applications, a layout of thesemiconductor device and an approach to manufacturing the device, inwhich tensile and/or compressive stress are selectively applied todifferent portions of the device, i.e., analog and digital portions, toenhance performance of the device and simultaneously reduce the effectsof flicker noise on the performance of the device.

In one aspect, the invention is directed to a method of fabricating acircuit. A plurality of devices of a plurality of conductivity types areformed in a plurality of regions of the circuit, the plurality ofdevices being adapted to perform in a plurality of associatedoperational modes. A mechanical stress is applied to at least oneselected device, the selected device being selected based on itsassociated operational mode.

The operational modes can include an analog mode and a digital mode. Theoperational modes can also include a noise-sensitive mode and anoise-insensitive mode, a low-speed operation mode and a high-speedoperation mode, and a high-voltage operation mode and a low-voltageoperation mode.

In one embodiment, the devices comprise at least one PMOS device and/orone NMOS device. The devices can include at least one CMOS device.

In one embodiment, mechanical stress is applied to a channel of an NMOSdevice in the digital mode. In one embodiment, mechanical stress isapplied to the channel of a PMOS device in the digital mode.

In one embodiment, stress is not applied to a device operating in ananalog mode to prevent an increase in electrical noise. The electricalnoise can be flicker noise.

In one embodiment, applying a mechanical stress to at least one selecteddevice comprises forming a stress control layer on the circuit inproximity to the devices. The stress control layer can apply a tensilestress and/or a compressive stress. In one embodiment, stress is releasein the stress control layer in proximity to devices to which stress isnot to be applied. Releasing the stress in the stress control layer caninclude implanting ions into the stress control layer. Releasing thestress in the stress control layer can include selectively removingportions of the stress control layer. The stress control layer caninclude SiN, SiON or SiO₂. Forming the stress control layer can includean annealing step. Forming the stress control layer can includeperforming plasma-enhanced chemical vapor deposition (PECVD) and/orlow-pressure chemical vapor deposition (LPCVD).

In one embodiment, applying a mechanical stress to at least one selecteddevice comprises performing a silicidation process on the circuit. Inone embodiment, applying a mechanical stress to at least one selecteddevice further comprises: forming a capping layer on the circuit;selectively removing the capping layer in proximity to devices to whichstress is to be applied; and performing a second silicidation process toapply stress to the devices to which stress is to be applied.

In one embodiment, applying a mechanical stress to at least one selecteddevice comprises epitaxially growing a source/drain structure in adevice to which stress is to be applied.

In one embodiment, stress is applied to a first device in a first CMOSstructure and to a second device in the first CMOS structure; and stressis not applied to a first device in a second CMOS structure and to asecond device in the second CMOS structure. In one embodiment, the firstCMOS structure operates in a digital mode and the second CMOS structureoperates in an analog mode. In one embodiment, the first device in thefirst CMOS structure is a PMOS device; the second device in the firstCMOS structure is an NMOS device; the PMOS device has a compressivestress applied to its channel; and the NMOS device has a tensile stressapplied to its channel. In one embodiment, the first device in both thefirst CMOS structure and the second CMOS structure is a PMOS device. Inone embodiment, the second device in both the first CMOS structure andthe second CMOS structure is an NMOS device.

In one embodiment, applying the mechanical stress comprises: forming afirst stress control layer on the circuit, the stress control layerapplying a tensile stress on the devices; selectively removing the firststress control layer in proximity to devices that do not require tensilestress; forming a second stress control layer on the devices, the secondstress control layer applying a compressive stress on the devices;forming a stress release layer over the second stress control layer inproximity to a selected portion of the devices; and using the stressrelease layer, releasing stress in devices that do not require thecompressive stress. Releasing stress in devices that do not require thecompressive stress can include implanting ions into the stress releaselayer.

In one embodiment, applying the mechanical stress comprises: forming afirst stress control layer on the circuit, the stress control layerapplying a tensile stress on the devices; selectively removing the firststress control layer in proximity to devices that do not require tensilestress; forming a second stress control layer on the devices, the secondstress control layer applying a compressive stress on the devices; andselectively removing the second stress control layer in proximity todevices that do not require the compressive stress.

According to another aspect, the invention is directed to a circuit. Thecircuit includes a substrate on which are formed a plurality of devicesof a plurality of conductivity types in a plurality of regions of thecircuit, the plurality of devices being adapted to perform in aplurality of operational modes. At least one selected device among theplurality of devices has a mechanical stress applied thereto, theselected device being selected based on its operational mode.

The operational modes can include an analog mode and a digital mode. Theoperational modes can also include a noise-sensitive mode and anoise-insensitive mode, a low-speed operation mode and a high-speedoperation mode, and a high-voltage operation mode and a low-voltageoperation mode.

In one embodiment, the devices comprise at least one PMOS device and/orone NMOS device. The devices can include at least one CMOS device.

In one embodiment, mechanical stress is applied to a channel of an NMOSdevice in the digital mode. In one embodiment, stress is applied to achannel of a PMOS device in the digital mode.

In one embodiment, stress is not applied to a device operating in ananalog mode to prevent an increase in electrical noise. The electricalnoise can be flicker noise.

In one embodiment, the mechanical stress is applied to a selected deviceusing a stress control layer on the circuit in proximity to the devices.The stress control layer can apply a tensile and/or a compressivestress. In one embodiment, stress is released in the stress controllayer in proximity to devices to which stress is not applied. Portionsof the stress control layer in which stress is released can includeadditional implanted ions. In one embodiment, the stress control layeris absent in proximity to devices to which stress is not applied. Thestress control layer can include SiN, SiON and/or SiO₂. In oneembodiment, the stress control layer is annealed. In one embodiment, thestress control layer is a layer formed by PECVD or LPCVD.

In one embodiment, a means by which the mechanical stress is appliedcomprises silicide.

In one embodiment, a means by which the mechanical stress is appliedcomprises an epitaxially grown source/drain structure.

In one embodiment, stress is applied to a first device in a first CMOSstructure and to a second device in the first CMOS structure; and stressis not applied to a first device in a second CMOS structure and to asecond device in the second CMOS structure. In one embodiment, the firstCMOS structure operates in a digital mode and the second CMOS structureoperates in an analog mode. In one embodiment, the first device in thefirst CMOS structure is a PMOS device; the second device in the firstCMOS structure is an NMOS device; the PMOS device has a compressivestress applied to its channel; and the NMOS device has a tensile stressapplied to its channel. In one embodiment, the first device in both thefirst CMOS structure and the second CMOS structure is a PMOS device. Inone embodiment, the second device in both the first CMOS structure andthe second CMOS structure is an NMOS device.

In one embodiment, a means by which the mechanical stress is appliedcomprises: a first stress control layer on the circuit, the first stresscontrol layer applying a tensile stress on the devices, the first stresscontrol layer being present only in proximity to devices requiring thetensile stress; a second stress control layer on the devices, the secondstress control layer applying a compressive stress on the devices; and astress release layer over the second stress control layer in proximityto a selected portion of the devices, the stress release layer releasingstress in devices that do not require the compressive stress. In oneembodiment, the stress release layer comprises additional implantedions.

In one embodiment, a means by which the mechanical stress is appliedcomprises: a first stress control layer on the circuit, the stresscontrol layer applying a tensile stress on the devices, the first stresscontrol layer being present only in proximity to devices requiring thetensile stress; a second stress control layer on the devices, the secondstress control layer applying a compressive stress on the devices, thesecond stress control layer being present only in proximity to devicesrequiring the compressive stress.

According to another aspect, the invention is directed to a method offabricating a circuit. In accordance with the method, a first MOS deviceof a first conductivity type is formed in a first area of the circuit. Asecond MOS device of the first conductivity type is formed in a secondarea of the circuit. A stress is applied to channels of the first andsecond MOS devices. The stress applied to the channel of the second MOSdevice is released.

In one embodiment, a stress control layer is formed on the circuit inproximity to the first and second MOS devices, the stress control layerapplying the stress to the first and second MOS devices. The stresscontrol layer can be formed by low pressure chemical vapor deposition(LPCVD). The stress control layer can also be formed by plasma enhancedchemical vapor deposition (PECVD). The stress control layer can includeSiN formed at low temperature. In one embodiment, releasing the stresscomprises implanting ions into the stress control layer. The stresscontrol layer can comprise SiN.

In one embodiment, the stress is a compressive stress. In oneembodiment, the stress is a tensile stress.

According to another aspect, the invention is directed to a method offabricating a circuit. In accordance with the method, a first MOS deviceof a first conductivity type is formed in a first area of the circuit. Asecond MOS device of the first conductivity type is formed in a secondarea of the circuit. A stress is applied to a channel of the first MOSdevice.

In one embodiment, applying a stress to the channel of the first MOSdevice comprises forming a stress control layer on the circuit inproximity to the first and second MOS devices. The stress control layercan be formed by PECVD. The stress control layer can comprise SiON. Thestress control layer can comprise SiO₂.

In one embodiment, the method further comprises removing the stresscontrol layer from the second MOS device and leaving a portion of thestress control layer on the first MOS device. In one embodiment, themethod further comprises annealing the portion of the stress controllayer on the first MOS device.

In one embodiment, the method further comprises performing a first heattreatment to form a first phase silicide in proximity to the first andsecond MOS devices. A capping layer can be formed over the first andsecond MOS devices and the first phase silicide. A portion of thecapping layer on the first MOS device and the first phase silicide canbe removed. A second heat treatment can be performed to transform thefirst phase silicide into a second phase silicide.

In one embodiment, the stress is a compressive stress. In oneembodiment, the stress is a tensile stress.

According to another aspect, the invention is directed to a method offabricating a circuit. In accordance with the method, a first CMOSdevice is formed in a first area of the circuit, the first CMOS devicecomprising a first MOS device of a first conductivity type and a secondMOS device of a second conductivity type. A second CMOS device is formedin a second area of the circuit, the second CMOS device comprising athird MOS device of the first conductivity type and a fourth MOS deviceof the second conductivity type. A tensile stress is applied to achannel of one of the first and second MOS devices, and a compressivestress is applied to the other of the first and second MOS devices. Ifstress is applied to channels of the MOS device in the second area, thestress applied to the channels of the MOS devices in the second area isremoved.

In one embodiment, the method further comprises epitaxially growing asemiconductor layer in source/drain regions and on a gate of one of thefirst and second MOS devices, such that a compressive stress is appliedto the one of the first and second MOS devices. A stress control layeris formed over the other of the first and second MOS devices such that atensile stress is applied to the other of the first and second MOSdevices.

In one embodiment, a first stress control layer is formed over one ofthe first and second MOS devices, the first stress control layerapplying a tensile stress to the one of the first and second MOSdevices. In one embodiment, the first stress control layer comprises atleast one of SiN, SiON and SiO₂. A second stress control layer can beformed over the other of the first and second MOS devices, the secondstress control layer applying a compressive stress to the other of thefirst and second MOS devices. In one embodiment, the second stresscontrol layer comprises at least one of SiN and SiO₂.

In accordance with another aspect, the invention is directed to acircuit. The circuit includes a first MOS device of a first conductivitytype in a first area of the circuit and a second MOS device of the firstconductivity type in a second area of the circuit. A stress is appliedto a channel of the first MOS device and a stress is not applied to thechannel of the second MOS device.

In one embodiment, a stress control layer is formed on the first MOSdevice, the stress control layer applying the stress to the first MOSdevice. In one embodiment, the stress control layer comprises ionsimplanted into the stress control layer. In one embodiment, the stresscontrol layer comprises SiN. In one embodiment, the stress control layercomprises SiON. In one embodiment, the stress control layer comprisesSiO₂. In one embodiment, the stress is a compressive stress. In oneembodiment, the stress is a tensile stress.

In one embodiment, the circuit further comprises a second phase silicidein proximity to a source/drain structure of the first MOS device.

According to another aspect, the invention is directed to a circuit. Thecircuit comprises a first CMOS device in a first area of the circuit,the first CMOS device comprising a first MOS device of a firstconductivity type and a second MOS device of a second conductivity type.A second CMOS device in a second area of the circuit comprises a thirdMOS device of the first conductivity type and a fourth MOS device of thesecond conductivity type. A tensile stress is applied to a channel ofone of the first and second MOS devices, and a compressive stress isapplied to the other of the first and second MOS devices.

In one embodiment, the circuit further comprises an epitaxially grownsemiconductor layer in source/drain regions and on a gate of one of thefirst and second MOS devices, such that a compressive stress is appliedto the one of the first and second MOS devices.

In one embodiment, the circuit further comprises a stress control layerover the other of the first and second MOS devices such that a tensilestress is applied to the other of the first and second MOS devices.

In one embodiment, the circuit further comprises a first stress controllayer over one of the first and second MOS devices, the first stresscontrol layer applying a tensile stress to the one of the first andsecond MOS devices. In one embodiment, the first stress control layercomprises at least one of SiN, SiON and SiO₂. In one embodiment, thecircuit further comprises a second stress control layer over the otherof the first and second MOS devices, the second stress control layerapplying a compressive stress to the other of the first and second MOSdevices. The second stress control layer can include at least one of SiNand SiO₂.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of the invention will beapparent from the more particular description of preferred embodimentsof the invention, as illustrated in the accompanying drawing. Thedrawings are not necessarily to scale, emphasis instead being placedupon illustrating the principles of the invention. Like referencecharacters refer to like elements throughout the drawings.

FIG. 1 is a schematic cross-sectional view of a MOS device illustratingan approach to introducing mechanical stress to improve carrier mobilityin the device.

FIGS. 2A and 2B are graphs illustrating the relationship between stressengineering in a MOS device and noise.

FIG. 3 contains a flow chart illustrating one approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice.

FIG. 4 contains a flow chart illustrating another approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice.

FIG. 5 contains a flow chart illustrating another approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice.

FIGS. 6 through 8 contain schematic cross-sectional views illustrating amethod of forming a semiconductor device in accordance with anembodiment of the invention.

FIGS. 9 and 10 contain schematic cross-sectional views illustrating amethod of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIGS. 11 through 13 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIGS. 14 through 16 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIGS. 17 through 20 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIGS. 21 through 27 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIGS. 28 through 31 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention.

FIG. 32 contains a schematic cross-sectional view illustrating a methodof forming a semiconductor device in accordance with another embodimentof the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

In accordance with the invention, a semiconductor device such as an LSIdevice having mixed-signal applications, i.e., analog and digitalapplications, a layout of the semiconductor device and an approach tomanufacturing the device, in which tensile and/or compressive stress areselectively applied to different portions of the device, i.e., analogand digital portions, are provided to enhance performance of the deviceand simultaneously reduce the effects of flicker noise on theperformance of the device.

In the following description, several embodiments of the invention aredescribed. The various embodiments can be considered to belong to one ofthree categories of embodiments, the categories being defined by thegeneral approach to selectively applying stress engineering to a deviceto enhance performance while limiting the effects of noise on thedevice. FIGS. 3 through 5 contain flow charts which illustrate the threecategories, respectively, of the embodiments of the invention. Thesecategories are not to be construed as limiting the invention in any way.They are defined only for the purposes of clarity of the description andease of understanding of the invention.

FIG. 3 contains a flow chart illustrating one approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice. FIG. 3 illustrates the first category of embodiments of theinvention.

Referring to FIG. 3, in a step 52, a first MOS device of a firstconductivity type, i.e., n-type or p-type, is formed in a first area ofa device, for example a digital area, i.e., an area of the device inwhich digital circuits are being formed. A second MOS device of thefirst conductivity type, i.e., n-type or p-type, is formed in a secondarea of the device, i.e., an area of the device in which analog circuitsare formed. Stress engineering is applied to selectively apply a localstress to the channels of the first and second MOS devices in the firstand second areas in step 54. In step 56, stress is released or relievedin the channel of the second MOS device in the second area.

The above approach results in stress being applied only to the channelof the first MOS device. The first MOS device with the stress appliedwill have the enhanced performance characteristics resulting from theapplied stress, but it may also have increased noise. On the other hand,the second MOS device will not have local stress applied, resulting in acircuit with reduced effects due to flicker noise. This approach can beapplied in situations such as where the first area contains circuitswhich are less sensitive to noise than those in the second area. Forexample, the first area may include digital circuits, circuits forlow-voltage operation and/or noise insensitive circuits, and the secondarea may include analog circuits, circuits for high-voltage operationand/or noise-sensitive circuits.

In one embodiment, the local stress can be applied by forming a stresscontrol layer in both the first and second area. To release the stresson the second MOS device, ion implantation can be used, or the portionof the stress control layer on the second MOS device can be removed.Specific embodiments of this first category or group of approaches inaccordance with the invention will be described in more detail below.

FIG. 4 contains a flow chart illustrating another approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice. FIG. 4 illustrates the second category of embodiments of theinvention.

Referring to FIG. 4, in a step 62, a first MOS device of a firstconductivity type, i.e., n-type or p-type, is formed in a first area ofa device, for example a digital area, i.e., an area of the device inwhich digital circuits are being formed. A second MOS device of thefirst conductivity type, i.e., n-type or p-type, is formed in a secondarea of the device, i.e., an area of the device in which analog circuitsare formed. Stress engineering is applied to selectively apply a localstress to the channel of the first MOS device in the first area in step64.

The above approach results in stress being applied only to the channelof the first MOS device. The first MOS device with the stress appliedwill have the enhanced performance characteristics resulting from theapplied stress, but it may also have increased noise. On the other hand,the second MOS device will not have local stress applied, resulting in acircuit with reduced effects due to flicker noise. This approach can beapplied in situations such as where the first area contains circuitswhich are less sensitive to noise than those in the second area. Forexample, the first area may include digital circuits, circuits forlow-voltage operation and/or noise insensitive circuits, and the secondarea may include analog circuits, circuits for high-voltage operationand/or noise-sensitive circuits.

Specific embodiments of this second category or group of approaches inaccordance with the invention will be described in more detail below.

FIG. 5 contains a flow chart illustrating another approach to forming adevice in accordance with the invention in which stress engineering isselectively applied to one or more selected portions of the device toenhance device performance while reducing the effects of noise on thedevice. FIG. 5 illustrates the third category of embodiments of theinvention.

Referring to FIG. 5, in a step 66, a first CMOS device, which includes afirst MOS device of a first conductivity type, i.e., n-type or p-type,and a second MOS device of a second conductivity type, i.e., p-type orn-type, is formed in a first area of a device, for example a digitalarea, i.e., an area of the device in which digital circuits are beingformed. A second CMOS device, which includes a first (third) MOS deviceof the first conductivity type, i.e., n-type or p-type, and a second(fourth) MOS device of a second conductivity type, i.e., p-type orn-type, is formed in a second area of the device, i.e., an area of thedevice in which analog circuits are formed. Stress engineering isapplied to selectively apply a local tensile stress and a localcompressive stress to at least the channels of the first and second MOSdevices in the first CMOS device in step 68. In step 70, stress isreleased or relieved in the channels of the MOS devices of the secondCMOS device.

The above approach results in stress being applied only to the channelsof the first and/or second MOS devices of the first CMOS device. Thefirst CMOS device with the stress applied will have the enhancedperformance characteristics resulting from the applied stress, but itmay also have increased noise. On the other hand, the second CMOS devicewill not have local stress applied, resulting in a circuit with reducedeffects due to flicker noise. This approach can be applied in situationssuch as where the first area contains circuits which are less sensitiveto noise than those in the second area. For example, the first area mayinclude digital circuits, circuits for low-voltage operation and/ornoise insensitive circuits, and the second area may include analogcircuits, circuits for high-voltage operation and/or noise-sensitivecircuits.

FIGS. 6 through 8 contain schematic cross-sectional views illustrating amethod of forming a semiconductor device in accordance with anembodiment of the invention. This embodiment is of the type definedwithin the first category of embodiments described above.

Referring to FIG. 6, a substrate 100, made of, for example, silicon, isprovided. The device includes a digital circuit area and an analogcircuit area. Each of the digital circuit area and the analog circuitarea includes a first NMOS transistor and a first PMOS transistor. Ashallow trench isolation (STI) 102 is formed in the substrate 100 toisolate the devices. Each of the transistors includes source/drainregions 128, each of which includes a lightly-doped source/drain region122 and a heavily-doped source/drain region 126. A gate dielectric layerpattern 110 is formed on the substrate for each transistor. A conductivegate pattern 120 is formed on a respective gate dielectric layer pattern110 for each transistor, and a silicide layer pattern 130 is formed overeach of the conductive gate patterns 120 and over exposed portions ofthe source/drain regions 128, specifically, over portions of theheavily-doped source/drain regions 126. The silicide layer patterns canbe formed of, for example, cobalt silicide, nickel silicide, titaniumsilicide, or tungsten silicide. Sidewall spacers 124 are formed on thesides of all of the gate structures, including the gate dielectric layerpatterns 110, the conductive gate patterns 120 and the silicide layerpatterns 130. In one embodiment, it is desirable that, in the analogcircuit area, the distance between the transistor gate structure and theSTI 102, i.e., d₁, d₂, d₃, d₄, be more than 1.5 um.

Referring to FIG. 7, a stress control layer 150 is formed over thestructure. The stress control layer 150 applies a compressive stress tothe channels 104 a, 104 b, 104 c, 104 d of the transistors, as indicatedby the arrows in the figure. The stress control layer 150 can be a layerof silicon nitride (SiN) deposited to a thickness of about 20-150 nm byplasma enhanced chemical vapor deposition (PECVD). A silicon nitridelayer formed under a low temperature condition of 200-400 degrees C., ora silicon oxide layer with a compressive stress can also be used.

Referring to FIG. 8, the compressive stress is selectively released overthe NMOS transistor of the digital circuit area and both of thetransistors of the analog circuit area. A photoresist mask 160 is formedto cover only the PMOS transistor of the digital circuit area. Ions suchas genmanium, silicon, arsenic, indium, antimony, etc., ions areimplanted, as indicted by 162, into the stress control layer 150, usingthe photoresist 160 as an ion implantation mask. In one embodiment, itis desirable that the ion implant energy be controlled within the rangeof 20-100 KeV, with consideration given to the thickness of the stresscontrol layer 150, such that the implant ions are substantiallyprevented from being implanted into the silicide layer patterns 130.

As a result of the ion implantation, the stress control layer 150 isconverted into a stress release or relax layer 152 everywhere exceptover the PMOS transistor in the digital circuit area. Therefore,compressive stress remains applied only to the channel 104 b of the PMOStransistor in the digital circuit area. As a result, performance isimproved in the PMOS transistor in the digital circuit area. No stressis remaining on the NMOS transistor in the digital circuit area and onboth transistors in the analog circuit area, such that the flicker noisecharacteristics of those devices is not degraded. That is, in thisembodiment, a PECVD silicon nitride stress control layer is used toenhance performance of only a PMOS device in the digital circuit area.

FIGS. 9 and 10 contain schematic cross-sectional views illustrating amethod of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the first category of embodiments described above. In theembodiment of FIGS. 9 and 10, the formation of the portion of the deviceincluding the substrate 100, STI 102, source/drain regions 128, gatedielectric patterns 110, conductive gate patterns 120, silicide patterns130 and sidewall spacers 124 is the same as that of the embodiment ofFIGS. 6 through 8. Accordingly, description thereof will not berepeated.

Referring to FIG. 9, a stress control layer 250, which applies a tensilestress, is formed on the structure. The stress control layer 250 can bea silicon nitride layer formed to a thickness of about 20-150 nm by lowpressure chemical vapor deposition (LPCVD). Alternatively, the stresscontrol layer 250 can be formed by forming a silicon nitride layer undera high-temperature condition of 400-800 degrees C. The stress controllayer 250 can also be formed by forming a silicon oxynitride (SiON)layer by PECVD followed by an annealing step. Alternatively, the stresscontrol layer 250 can be a silicon oxide layer which applies a tensilestress. The resulting tensile stress is locally imposed on the channels204 a, 204 b, 204 c, 204 d of the transistors, as indicated in FIG. 9 bythe arrows.

Referring to FIG. 10, the tensile stress is selectively released overthe PMOS transistor of the digital circuit area and both of thetransistors of the analog circuit area. A photoresist mask 260 is formedto cover only the NMOS transistor of the digital circuit area. Ions suchas germanium, silicon, arsenic, indium, antimony, etc., ions areimplanted, as indicted by 262, into the stress control layer 150, usingthe photoresist 260 as an ion implantation mask. In one embodiment, itis desirable that the ion implant energy be controlled within the rangeof 20-100 KeV, with consideration given to the thickness of the stresscontrol layer 250, such that the implant ions are substantiallyprevented from being implanted into the silicide layer patterns 130.

As a result of the ion implantation, the stress control layer 250 isconverted into a stress release or relax layer 252 everywhere exceptover the NMOS transistor in the digital circuit area. Therefore, tensilestress remains applied only to the channel 204 a of the NMOS transistorin the digital circuit area. As a result, performance is improved in theNMOS transistor in the digital circuit area. No stress is remaining onthe PMOS transistor in the digital circuit area and on both transistorsin the analog circuit area, such that the flicker noise characteristicsof those devices is not degraded. That is, in one embodiment, a LPCVDsilicon nitride stress control layer is used to enhance performance ofonly an NMOS device in the digital circuit area.

FIGS. 11 through 13 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the second category of embodiments described above. In theembodiment of FIGS. 11 through 13, the formation of the portion of thedevice including the substrate 100, STI 102, source/drain regions 128,gate dielectric patterns 110, conductive gate patterns 120, silicidepatterns 130 and sidewall spacers 124 is the same as that of theembodiment of FIGS. 6 through 8. Accordingly, description thereof willnot be repeated.

Referring to FIG. 11, a stress control layer 350, which applies noinitial net stress, is formed on the structure. The stress control layer350 can be a silicon oxynitride layer formed to a thickness of about20-150 nm by plasma enhanced chemical vapor deposition (PECVD).

Referring to FIG. 12, a photoresist pattern 360 is formed and patternedsuch that it remains only over the NMOS transistor in the digitalcircuit area. Next, using the photoresist pattern 360 as a mask, thestress control layer 350 is removed everywhere except over the NMOStransistor in the digital circuit area.

Next, referring to FIG. 13, the photoresist pattern 360 is removed, andthe remaining portion of the stress control layer is annealed. As aresult of the annealing, the stress control layer 350 is converted intoa tensile stress layer 352, which applies a tensile stress to thechannel 304 a of the NMOS transistor in the digital circuit area asshown by the arrows in the figure. The remaining transistor channels 304b, 304 c, 304 d have no stress applied, due to the absence of thetensile stress layer 352 in their respective transistor regions.

Hence, in this embodiment, tensile stress is locally imposed on thechannel 304 a of the NMOS transistor in the digital circuit area. As aresult, performance is improved in the NMOS transistor in the digitalcircuit area. No stress is applied to the PMOS transistor in the digitalcircuit area or on both transistors in the analog circuit area, suchthat the flicker noise characteristics of those devices is not degraded.Hence, in this embodiment, an annealed PECVD silicon oxynitride layer,which has a tensile stress, is used to enhance performance of only anNMOS device in the digital circuit area.

FIGS. 14 through 16 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the second category of embodiments described above. In theembodiment of FIGS. 14 through 16, the formation of the portion of thedevice including the substrate 100, STI 102, source/drain regions 128,gate dielectric patterns 110, conductive gate patterns 120 and sidewallspacers 124 is the same as that of the embodiment of FIGS. 6 through 8.Accordingly, description thereof will not be repeated. In the embodimentof FIGS. 14 through 16, an annealed PECVD layer of silicon dioxide SiO₂,which has a tensile stress, is formed to enhance NMOS performance.

Referring to FIG. 14, a SiO₂ layer 450 is formed on the structure. TheSiO₂ layer 450 can be formed to a thickness of about 20-100 nm by plasmaenhanced chemical vapor deposition (PECVD) at a temperature below about600 degrees C.

Referring to FIG. 15, the portion of the SiO₂ layer on the NMOStransistor of the analog circuit area is removed. Next, the SiO₂ layeris annealed at a temperature of 900-1150 degrees C. to introduce atensile stress in the SiO₂ layer and, therefore in the NMOS transistorof the digital circuit area. It is noted that the SiO₂ layer is removedfrom the NMOS transistor in the analog circuit area because it isdesired to prevent stress from being applied to that transistor. Theportion of the SiO₂ layer over the PMOS transistors need not be removedbecause the annealing of the SiO₂ layer will not affect the PMOStransistors. For example, it is known that residual compressive stressin arsenic implanted polysilicon (as used typically in an NMOS gate) isinduced by high-temperature annealing of the CVD SiO₂ with high tensilestress. Accordingly, after the annealing, there is tensile stressapplied to the channel 404 a and compressive stress applied to the gate120 of the NMOS transistor in the digital circuit area, as indicated bythe arrows in the figure. There is no stress applied to any of the otherchannels 404 b, 404 c, 404 d or gates 120.

Next, referring to FIG. 16, the remaining portion of the SiO₂ layer canbe removed to permit subsequent process steps, such as silicidation ofthe source/drain regions of the device. It should be noted that theremaining portion of the SiO₂ layer need not be removed. The compressivestress in the gate 120 and the tensile stress in the channel 404 a willbe maintained, whether the SiO₂ layer is completely removed or itremains on the NMOS transistor in the digital circuit area.

Hence, in this embodiment, tensile stress is locally imposed on thechannel 404 a of the NMOS transistor in the digital circuit area andcompressive stress is applied to its gate. As a result, performance isimproved in the NMOS transistor in the digital circuit area. No stressis applied to the PMOS transistor in the digital circuit area or on bothtransistors in the analog circuit area, such that the flicker noisecharacteristics of those devices is not degraded. It should be notedthat, in this embodiment, the heat budget for source/drain activationcan be used to induce tensile stress without introducing an additionalhigh-temperature anneal process.

FIGS. 17 through 20 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the second category of embodiments described above. In thisembodiment, a silicidation process is used to enhance performance of anNMOS transistor. In the embodiment of FIGS. 17 through 20, the formationof the portion of the device including the substrate 100, STI 102,source/drain regions 128, gate dielectric patterns 110, conductive gatepatterns 120 and sidewall spacers 124 is the same as that of theembodiment of FIGS. 6 through 8. Accordingly, description thereof willnot be repeated. However, it is noted that in the embodiment of FIGS. 17through 20, silicide patterns 830 are shown instead of the silicidepatterns 130. In this embodiment, it is these silicide patterns 830, asdescribed below, that enhance the NMOS performance.

Referring to FIG. 17, the silicide patterns 830 are formed by depositinga metal layer pattern on the structure where the silicide patterns 830are to be formed, i.e., on the silicon of the source/drain regions 128and conductive gate 120. The metal can be, for example, cobalt. Then, afirst rapid thermal annealing (RTA) process is carried out atapproximately 450 degrees C. to form patterns of cobalt monosilisideCoSi 830. That is, a first phase metal silicide is formed by a firstheat treatment. After the first RTA is performed, the remaining cobaltis removed.

Referring to FIG. 18, a capping layer 840 is formed over the structureafter the first RTA is performed. The capping layer 840 can be a layerof titanium nitride TiN formed to a thickness of about 5-20 nm.

Referring to FIG. 19, a photoresist pattern 860 is formed over thestructure such that only the portion of the capping layer 840 that isformed over the NMOS transistor in the digital circuit area is exposed.Then, that exposed portion of the capping layer 840 is removed. Next, asecond RTA process is carried out at a temperature of about 700-1100degrees C. As a result of the second RTA process, the silicidationpatterns 830 transition to a second phase metal silicide, for example,the CoSi transitions to cobalt disilicide CoSi₂. This results information of new silicide patterns 830 a on the gates and source/drainregions. During the process of transition from the first phase metalsilicide, e.g., CoSi, to the second phase metal silicide, e.g., CoSi2, atensile stress is imposed on the channel 804 a of the NMOS transistor inthe digital circuit area. Relatively little or no tensile stress isapplied to the other channels 804 b, 804 c, 804 d because the cappinglayer 840 over their respective transistors acts to attenuate stress.That is, tensile stress is locally imposed on the channel 804 a of theNMOS transistor in the digital circuit area, but the channels 804 b, 804c, 804 d of the remaining transistors are not affected by the annealingbecause there is present on the transistors a capping layer 840 forstress attenuation.

Referring to FIG. 20, the remainder of the capping layer 840 is removed.The result is a device with silicide layers 830 a which apply a tensilestress to the channel 804 a of the NMOS transistor in the digitalcircuit area and which do not apply a stress to the remainingtransistors.

FIGS. 21 through 27 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the third category of embodiments described above. In thisembodiment, an epitaxially grown source/drain structure is used toinduce compressive stress on a PMOS transistor to enhance performance ofthe PMOS transistor.

Referring to FIG. 21, CMOS structures, each including an NMOS transistorand a PMOS transistor, are formed in both a digital circuit area and ananalog circuit area of a device. The device includes a digital circuitarea and an analog circuit area. Each of the digital circuit area andthe analog circuit area includes a first NMOS transistor and a firstPMOS transistor. A substrate 100, made of, for example, silicon, isprovided. A shallow trench isolation (STI) 102 is formed in thesubstrate 100 to isolate the devices. Each of the transistors includessource/drain regions 128, each of which includes a lightly-dopedsource/drain region 122 and a heavily-doped source/drain region 126. Agate dielectric layer pattern 110 is formed on the substrate for eachtransistor. A conductive gate pattern 120 is formed on a respective gatedielectric layer pattern 110 for each transistor, and sidewall spacers124 are formed on the sides of all of the gate structures, including thegate dielectric layer patterns 110 and the conductive gate patterns 120.

Referring to FIG. 22, a mask layer 510 is formed over the structure ofFIG. 21. The mask layer can be made of, for example, silicon dioxide,silicon nitride, or other similar material.

Referring to FIG. 23, the portion of the mask layer 510 that is over thePMOS transistor in the digital circuit area is at least partiallyremoved, leaving a small portion of the mask layer 510 on the sidewallspacer 124. Then, a portion of the source/drain region 128 of theexposed PMOS transistor is removed beside its gate structure by aself-aligned, vertical, anisotropic etching. As a result, a groove 520is formed to have a depth of about 10-100 nm.

Referring to FIG. 24, a semiconductor layer 522 is selectively andepitaxially grown on the groove 520 and the top of the conductive gate120. The epitaxial layer 522 can be SiGe, SiC, or other such material.The layer 522 imposes compressive stress on the channel 504 b of thePMOS transistor in the digital circuit area, as indicated by the arrowsin the figure. This compressive stress is due to the larger latticeconstant of the epitaxially grown semiconductor layer 522. The materialwith the larger lattice constant exerts pressure on the material of thechannel 504 b, resulting in the compressive stress in the channel 504 b.That is, the epitaxially grown semiconductor layer 522 and the substrate100 have different crystal lattice structures and/or different thermalexpansion coefficients, which produces a mechanical stress in thechannel of the transistor, thereby affecting the mobility of carriers inthe channel.

Referring to FIG. 25, the remainder of the mask layer 510 is removedfrom the structure. Then, metal silicide layers 530, which can be nickelsilicide, cobalt silicide, or other similar material, are formed on thegate conductive patterns 120 and exposed source/drain regions 128, andon top of the epitaxially grown semiconductor layer 522 in the PMOStransistor in the digital circuit area.

Next, referring to FIG. 26, a stress control layer 550, having a tensilestress, is formed on the structure. The stress control layer 550 can bea silicon nitride layer formed to a thickness of about 20-150 nm byLPCVD. The stress control layer 550 can be a silicon nitride layerformed under a high-temperature condition of 400-800 degrees C.Alternatively, the stress control layer 550 can be an annealed SiONlayer formed by PECVD, or a tensile stress silicon oxide layer. As aresult, tensile stress is locally imposed on the channels 504 a, 504 b,504 c, 504 d.

Next, referring to FIG. 27, the tensile stress is selectively releasedin the PMOS transistor in the digital circuit area and both of thetransistors of the analog circuit area. A photoresist mask pattern 560is formed over the NMOS transistor in the digital circuit area. Then,ions such as germanium, silicon, arsenic, indium, antimony, or othersimilar ions are implanted into the structure everywhere except in theNMOS transistor in the digital circuit area. As a result, the tensilestress is released in the PMOS transistor in the digital circuit areaand in both transistors in the analog circuit area. After the ionimplantation, tensile stress is locally imposed on the channel 504 a ofthe NMOS transistor in the digital circuit area, and compressive stressis locally imposed in the channel 504 b of the PMOS transistor in thedigital circuit area, as indicated by the arrows in the figure. No netstress is imposed on the channels 504 c and 504 d of the transistors inthe analog circuit area.

FIGS. 28 through 31 contain schematic cross-sectional views illustratinga method of forming a semiconductor device in accordance with anotherembodiment of the invention. This embodiment is of the type definedwithin the third category of embodiments described above. In thisembodiment, a tensile and a compressive layer are separately formed toinduce stress in both the NMOS and PMOS transistors in the digitalcircuit area. In the embodiment of FIGS. 28 through 31, the formation ofthe portion of the device including the substrate 100, STI 102,source/drain regions 128, gate dielectric patterns 110, conductive gatepatterns 120, silicide patterns 130 and sidewall spacers 124 is the sameas that of the embodiment of FIGS. 6 through 8. Accordingly, descriptionthereof will not be repeated.

Referring to FIG. 28, a first stress control layer 650, which has atensile stress, is formed over the structure. The first stress controllayer 650 can be a silicon nitride layer formed to a thickness of about20-150 nm by LPCVD. The layer 650 can be a silicon nitride layer formedunder a high-temperature condition of 400-800 degrees C. Alternatively,the layer 650 can be an annealed SiON layer formed by PECVD, or asilicon oxide layer with tensile stress. As a result of formation of thefirst stress control layer, tensile stress is locally imposed on thechannels 604 a, 604 b, 604 c, 604 d of the transistors in both thedigital circuit area and the analog circuit area, as indicated by thearrows in the figure.

Referring to FIG. 29, the portion of the first stress control layer 650over the PMOS transistor in the digital circuit area and over bothtransistors in the analog circuit area is removed. A photoresist pattern654 is formed to cover only the NMOS transistor in the digital circuitarea, and the exposed portion of the first stress control layer 650 isremoved. It should be noted that if a PECVD SiON layer is used as thefirst stress control layer 650, then it is desirable that the annealingprocess be carried out after selectively removing the first stresscontrol layer 650 from the PMOS transistor in the digital circuit areaand the transistors in the analog circuit area. As a result of theselective removal of the first stress control layer 650, a tensilestress remains applied to only the channel 604 a of the NMOS transistorin the digital circuit area, as shown by the arrows in the figure.

Referring to FIG. 30, a second stress control layer 660, which has acompressive stress, is formed over the structure. The second stresscontrol layer 660 can be, for example, a layer of silicon nitride formedto a thickness of about 20-150 nm by PECVD. The second stress controllayer 660 can be a silicon nitride layer formed under a low-temperaturecondition of 200-400 degrees C. The second stress control layer 660 canalternatively be a silicon oxide layer with a compressive stress. As aresult of the formation of the second stress control layer 660, acompressive stress is applied to all of the channels 604 a, 604 b, 604c, 604 d, and the channel 604 a has both a compressive stress and atensile stress applied, as shown by the arrows in the figure.

Referring to FIG. 31, the second stress control layer 660 is selectivelyconverted to a stress release or relax layer 662 over all of thetransistors except the PMOS transistor in the digital circuit area. Aphotoresist mask pattern 670 is formed over only the PMOS transistor inthe digital circuit area. Ions such as germanium, silicon, arsenic,indium, antimony, or other similar ions, are implanted, indicated by672, into the second stress control layer 660, except in the portion ofthe second stress control layer 660 that covers the PMOS transistor inthe digital circuit area. The ion implantation releases the compressivestress in the exposed portion of the second stress control layer 660,such that the exposed portion of the second stress control layer becomesthe stress release or relax layer 662. As a result, tensile stress islocally imposed only on the channel 604 a of the NMOS transistor in thedigital circuit area, and compressive stress is locally imposed only onthe channel 604 b of the PMOS transistor in the digital circuit area, asindicated by the arrows in the figure. Hence, performance of both theNMOS transistor and PMOS transistor in the digital circuit area isenhanced, while the transistors in the analog circuit area remainunaffected by applied stress, such that the transistors in the analogcircuit area are not degraded by noise that may result from theapplication of stress on the transistors.

FIG. 32 contains a schematic cross-sectional views illustrating a methodof forming a semiconductor device in accordance with another embodimentof the invention. This embodiment is of the type defined within thethird category of embodiments described above. The embodiment of FIG. 32is a variation of that of FIGS. 28 through 31. The steps shown in FIGS.28 through 30 are also used in the embodiment of FIG. 32. Accordingly,description of those steps will not be repeated.

Referring to FIG. 32, after the second stress control layer 660 having acompressive stress is formed, the second stress control layer 660 isremoved everywhere except over the PMOS transistor in the digitalcircuit area. As a result, tensile stress is locally imposed on thechannel 704 a of the NMOS transistor in the digital circuit area, andcompressive stress is locally imposed on the channel 704 b of the PMOStransistor in the digital circuit area, as indicated by the arrows inthe figure.

Hence, in accordance with the invention, stress engineering isselectively applied to particular devices depending on their requiredoperational configurations. That is, the appropriate stress, i.e.,tensile or compressive, can be applied to and/or removed from devices,i.e., NMOS and/or PMOS devices, based not only on their conductivitytype, i.e., n-type or p-type, but also on their intended operationalapplication, for example, analog/digital, low-voltage/high-voltage,high-speed/low-speed, noise-sensitive/noise-insensitive, etc.

The present invention is applicable to circuits which include digital,analog and mixed-mode functions. For example, the invention isapplicable to memory LSI, such as DRAM and embedded DRAM. The approachof the invention is applicable to the DRAM cell and/or the DRAM senseamplifier, which is considered to be a noise-sensitive analog circuit.The invention is applicable to other circuits such as the senseamplifier circuit of memory circuits in discrete memory chip or embeddedmemory chip configurations of, for example, SRAM, flash memory, MRAM,PRAM, and other such devices. The invention is particularly applicableto these circuits because the sense amplifiers in these circuits arerequired to sense very small differences in currents, and, therefore,noise such as flicker noise can substantially degrade their performance.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present invention as defined by the following claims.

1. A method of fabricating a semiconductor device, comprising: forming afirst transistor having a first source and a first drain; forming asecond transistor having a second source and a second drain; removing aportion of the second source and the second drain of the secondtransistor; forming an epitaxial layer in the removed portion of thesecond source and the second drain of the second transistor; and forminga stress control layer on the semiconductor device.
 2. The method ofclaim 1, wherein the stress control layer comprises at least one of SiN,SiON and SiO₂.
 3. The method of claim 1, wherein the stress controllayer is formed under a high-temperature condition of 500 to 800° C. 4.The method of claim 1, wherein forming the stress control layercomprises at least one of PECVD and LPCVD.
 5. The method of claim 1,wherein the stress control layer applies a tensile stress.
 6. The methodof claim 5, wherein the first transistor is an NMOS transistor.
 7. Themethod of claim 1, wherein the second transistor is a PMOS transistor.8. The method of claim 7, wherein the epitaxial layer comprises at leastone of SiGe, SiC and other material having a larger lattice constantthan silicon.
 9. The method of claim 1, further comprising performing astress releasing step in the stress control layer formed on the secondtransistor.
 10. The method of claim 9, wherein the stress control layerapplies a tensile stress.
 11. The method of claim 10, furthercomprising: forming a third transistor having a third source and a thirddrain; and wherein the stress releasing step is performed in the stresscontrol layer formed on the third transistor.
 12. The method of claim11, wherein the third transistor is arranged in at least one of ananalog circuit area, noise-sensitive circuit, low-speed operationcircuit and high voltage operation circuit.
 13. The method of claim 9,wherein the stress releasing step comprises implanting ions into thestress control layer.
 14. The method of claim 9, wherein the stressreleasing step comprises etching the stress control layer disposed onthe second transistor.
 15. A method of fabricating a semiconductordevice, comprising: forming an NMOS transistor having an N-type sourceand an N-type drain; forming a PMOS transistor having a P-type sourceand a P-type drain; removing a portion of the P-type source and theP-type drain of the PMOS transistor; forming an epitaxial layer in theremoved portion of the P-type source and the P-type drain of the PMOStransistor; and forming a tensile stress layer on the semiconductordevice.
 16. The method of claim 15, wherein the tensile stress layercomprises at least one of SiN, SiON and SiO₂.
 17. The method of claim15, the epitaxial layer comprises at least one of SiGe, SiC and othermaterial having a larger lattice constant than silicon.
 18. The methodof claim 15, further comprising performing a stress releasing step inthe tensile stress layer formed on the PMOS transistor.
 19. The methodof claim 18, wherein the stress releasing step comprises implanting ionsinto the tensile stress layer.
 20. The method of claim 19, wherein thestress releasing step comprises etching the tensile stress layerdisposed on the PMOS transistor.
 21. A method of fabricating a circuit,comprising: forming a plurality of devices of a plurality ofconductivity types in a plurality of regions of the circuit, theplurality of devices being adapted to perform in a plurality ofoperational modes; and applying a mechanical stress to at least oneselected device, the selected device being selected based on itsoperational mode.
 22. The method of claim 21, wherein the operationalmodes comprise one selected from an analog mode, a digital mode, anoise-sensitive mode, a noise-insensitive mode, a low-speed operationmode, a high-speed operation mode, a high-voltage operation mode, and alow-voltage operation mode.
 23. The method of claim 21, wherein themechanical stress is applied to one of a channel of an NMOS device in adigital mode and a channel of a PMOS device in a digital mode.
 24. Themethod of claim 21, wherein stress is not applied to a device operatingin an analog mode to prevent an increase in electrical noise.
 25. Themethod of claim 24, wherein the electrical noise is flicker noise. 26.The method of claim 21, wherein applying a mechanical stress to at leastone selected device comprises forming a stress control layer on thecircuit in proximity to the devices.
 27. The method of claim 26, whereinthe stress control layer applies a tensile stress.
 28. The method ofclaim 26, wherein the stress control layer applies a compressive stress.29. The method of claim 26, further comprising releasing stress in thestress control layer in proximity to devices to which stress is not tobe applied.
 30. The method of claim 29, wherein releasing the stress inthe stress control layer comprises implanting ions into the stresscontrol layer.
 31. The method of claim 29, wherein releasing the stressin the stress control layer comprises selectively removing portions ofthe stress control layer.
 32. The method of claim 26, wherein the stresscontrol layer comprises at least one of SiN, SiON and SiO₂.
 33. Themethod of claim 26, wherein forming the stress control layer comprisesan annealing step.
 34. The method of claim 26, wherein forming thestress control layer comprises at least one of PECVD and LPCVD.
 35. Themethod of claim 21, further comprising performing a silicidation processon the circuit.
 36. The method of claim 35, wherein applying amechanical stress to at least one selected device further comprises:forming a capping layer on the circuit; selectively removing the cappinglayer in proximity to devices to which stress is to be applied; andperforming a second silicidation process to apply stress to the devicesto which stress is to be applied.
 37. The method of claim 21, whereinapplying a mechanical stress to at least one selected device comprisesepitaxially growing a source/drain structure in a device to which stressis to be applied.
 38. The method of claim 21, wherein: stress is appliedin a first device in a first CMOS structure and in a second device inthe first CMOS structure; and stress is not applied to a first device ina second CMOS structure and to a second device in the second CMOSstructure.
 39. The method of claim 38, wherein the first CMOS structureoperates in a digital mode and the second CMOS structure operates in ananalog mode.
 40. The method of claim 39, wherein: the first device inthe first CMOS structure is a PMOS device; the second device in thefirst CMOS structure is an NMOS device; the PMOS device has acompressive stress applied to its channel; and the NMOS device has atensile stress applied to its channel.
 41. The method of claim 21,wherein applying the mechanical stress comprises: forming a first stresscontrol layer on the circuit, the stress control layer applying atensile stress on the devices; selectively removing the first stresscontrol layer in proximity to devices to which tensile stress is not tobe applied; forming a second stress control layer on the devices, thesecond stress control layer applying a compressive stress on thedevices; forming a stress release layer over the second stress controllayer in proximity to a selected portion of the devices; and using thestress release layer, releasing stress in devices to which stress is notto be applied.
 42. The method of claim 41, wherein releasing stress indevices that do not require the stress comprises implanting ions intothe stress release layer.
 43. The method of claim 21, wherein applyingthe mechanical stress comprises: forming a first stress control layer onthe circuit, the stress control layer applying a tensile stress on thedevices; selectively removing the first stress control layer inproximity to devices to which tensile stress is not to be applied;forming a second stress control layer on the devices, the second stresscontrol layer applying a compressive stress on the devices; andselectively removing the second stress control layer in proximity todevices to which the compressive stress is not to be applied.
 44. Amethod of fabricating a circuit, comprising: forming a first MOS deviceof a first conductivity type in a first area of the circuit; forming asecond MOS device of the first conductivity type in a second area of thecircuit; applying a stress to channels of the first and second MOSdevices; and releasing the stress applied to the channel of the secondMOS device.
 45. The method of claim 44, further comprising forming astress control layer on the circuit in proximity to the first and secondMOS devices, the stress control layer applying the stress to the firstand second MOS devices.
 46. The method of claim 45, wherein releasingthe stress comprises implanting ions into the stress control layer. 47.The method of claim 44, wherein the stress is a compressive stress. 48.The method of claim 47, wherein the stress control layer comprises atleast one of SiN formed by plasma enhanced chemical vapor deposition andSiN formed at low temperature.
 49. The method of claim 44, wherein thestress is a tensile stress.
 50. The method of claim 49, wherein thestress control layer comprises at least one of SiN formed by lowpressure chemical vapor deposition (PECVD), SiN formed at hightemperature, SiON formed by plasma enhanced chemical vapor deposition,and SiO2 formed by PECVD.
 51. A method of fabricating a circuit,comprising: forming a first MOS device of a first conductivity type in afirst area of the circuit; forming a second MOS device of the firstconductivity type in a second area of the circuit; and applying a stressto a channel of the first MOS device.
 52. The method of claim 51,wherein applying a stress to the channel of the first MOS devicecomprises forming a stress control layer on the circuit in proximity tothe first and second MOS devices.
 53. The method of claim 52, whereinthe stress control layer comprises SiON.
 54. The method of claim 53,further comprising removing the stress control layer from the second MOSdevice and leaving a portion of the stress control layer on the firstMOS device.
 55. The method of claim 54, further comprising annealing theportion of the stress control layer on the first MOS device.
 56. Themethod of claim 52, wherein the stress control layer comprises SiO₂. 57.The method of claim 56, further comprising removing the stress controllayer from the second MOS device and leaving a portion of the stresscontrol layer on the first MOS device.
 58. The method of claim 57,further comprising annealing the portion of the stress control layer onthe first MOS device.
 59. The method of claim 51, further comprisingperforming a first heat treatment to form a first phase silicide inproximity to the first and second MOS devices.
 60. The method of claim59, further comprising forming a capping layer over the first and secondMOS devices and the first phase silicide.
 61. The method of claim 60,further comprising removing a portion of the capping layer on the firstMOS device and the first phase silicide.
 62. The method of claim 61,further comprising performing a second heat treatment to transform thefirst phase silicide into a second phase silicide.
 63. A method offabricating a circuit, comprising: forming a first CMOS device in afirst area of the circuit, the first CMOS device comprising a first MOSdevice of a first conductivity type and a second MOS device of a secondconductivity type; forming a second CMOS device in a second area of thecircuit, the second CMOS device comprising a third MOS device of thefirst conductivity type and a fourth MOS device of the secondconductivity type; applying a tensile stress to a channel of one of thefirst and second MOS devices, and applying a compressive stress to theother of the first and second MOS devices; and if stress is applied tochannels of the MOS device in the second area, removing the stressapplied to the channels of the MOS devices in the second area.
 64. Themethod of claim 63, further comprising epitaxially growing asemiconductor layer in source/drain regions and on a gate of one of thefirst and second MOS devices, such that a compressive stress is appliedto the one of the first and second MOS devices.
 65. The method of claim64, further comprising forming a stress control layer over the other ofthe first and second MOS devices such that a tensile stress is appliedto the other of the first and second MOS devices.
 66. The method ofclaim 63, further comprising forming a first stress control layer overone of the first and second MOS devices, the first stress control layerapplying a tensile stress to the one of the first and second MOSdevices.
 67. The method of claim 66, wherein the first stress controllayer comprises at least one of SiN, SiON and SiO₂.
 68. The method ofclaim 66, further comprising forming a second stress control layer overthe other of the first and second MOS devices, the second stress controllayer applying a compressive stress to the other of the first and secondMOS devices.
 69. The method of claim 68, wherein the second stresscontrol layer comprises at least one of SiN and SiO₂.